Vacuum soldering
The oven with VACUUM MODULE for ACTIVE VOID REMOVAL is essential for electronics that require extremely high performance levels, such as life-saving devices, aircraft control systems and driver assistance systems in the automotive sector.
These must be able to function in the long term in a completely safe manner and without any error, and to do so they must be free of VOIDS in solder joints.
This is possible thanks to the VOID FREE SOLDERING module that guarantees active and effective removal of VOIDS in solder joints.
The system is positioned between the reflow zone and the cooling zone, i.e., where the metal alloy is still in liquid phase.
The Vacuum acts by generating vacuum for the active removal of voids present in joints. The system also features standard heating panels so that, when it is not necessary to use the Vacuum, it can operate as an additional thermal zone.
The REDUCTION of VOIDS from solder joints allows to:
- INCREASE THE COMPONENT LIFECYCLE
- IMPROVE THERMAL CONDUCTIVITY
- REDUCE THE COMPONENT OPERATING TEMPERATURE
Features
- Void reduction up to 99%
- The VACUUM process can be activated and deactivated as needed
- Air or Nitrogen (without consumption increase)
- Double Reflow
- Top and Bottom Clearance: 30mm
- Adjustment of TIME, PRESSURE and VACUUM parameters
