NIHON-HANDA solder paste
Nihon Handa, leading Japanese company, offers different types of solder paste. From lead alloys to Lead Free alloys. They are all available in various types of packaging (jar, Proflow cassette, syringe, etc.) Nihon Handa positions itself as a company capable of meeting the widest market and customer demands, being a producer of both powders and flux present in solder paste. Furthermore, the collaboration with Tecnolab guarantees the customer constant support both at technical level and in order management.
– RX 262 110 HO V1a (Sn 62%– Ag 2%) Recommended for applications where low flux residue is required and where the components on the board include fine-pitch up to 0.40 mm and micro BGA.
– PF 305 118 HO (Sn 96.5%– Cu 0.5%) Recommended for applications where low flux residue is required where the components on the board include fine-pitch up to 0.40 mm and micro BGA.
– PF 305 155 TO (Sn 96.5% – Cu 0.5%) Designed to ensure a drastic reduction of Voids (-30%). It is ideal for mounting micro components QFP, BGA, fine pitch 0.4mm. It has excellent wettability even with materials and finishes that are difficult to solder.
Our process engineer, Roberto Crippa, can help you choose the solution best suited to your needs.
