NIHON-HANDA solder paste
Nihon Handa, a leading Japanese company, offers a range of solder pastes: from lead-containing alloys to lead-free alloys. They are all available in various packaging formats (tubs or syringes). Nihon Handa positions itself as a company capable of meeting the widest range of market and customer requirements, as it manufactures both the powders and the flux contained in the solder paste. Furthermore, its partnership with Tecnolab guarantees customers constant support, both technically and in terms of order management.
– RX 262 110 HO V1a (Sn 62% – Pb 36% – Ag 2%) Recommended for applications where low flux residue is required and where the components on the board feature fine-pitch spacing down to 0.40 mm and micro BGAs.
– PF 305 153 TO (Sn 96.5% – Ag 3% – Cu 0.5%) Recommended for applications where low flux residue is required and where the components on the board feature fine-pitch spacing of up to 0.40 mm and micro-BGAs.
– PF 305 155 TO (Sn 96.5% – Ag 3% – Cu 0.5%) Designed to ensure a drastic reduction in voids (-30%). It is ideal for the assembly of micro QFP and BGA components with a fine pitch of 0.4 mm. It offers excellent wettability even with materials and finishes that are difficult to solder.
Our process engineer, Roberto Crippa, can help you choose the solution best suited to your needs.
