Cheetah EVO
With technological progress advancing at an ever-increasing pace, Yxlon was among the first to recognize that a “one-size-fits-all” approach to X-ray systems would not allow for tailored, cost-effective packages that truly meet end-user requirements. For this reason, three configurations were developed, each specifically designed to address the different needs of the relevant industrial sectors.
From this decision comes the Microfocus Cheetah EVO SMT version, which stands out for its ability to deliver extremely accurate and sharp images in the shortest possible time (time to first image < 10 sec). The first usable X-ray image is available within seconds, allowing even inexperienced operators to quickly achieve optimal results. The system enables inspection of target components within a working area of 460 × 410 mm, with a maximum loadable area of 800 × 500 mm.
- Fast, repeatable, and accurate inspections
- High power & high resolution: the ideal combination for excellent image quality even with materials that are difficult to penetrate
- Smart Factory solution: ideal for Industry 4.0 applications. One-click operation with multiple functions: Click & Center, Frame & Zoom, Power Drive
Features
- Advanced Multi-Slice Technology: laminography enables non-destructive inspection of large areas without micro-sectioning samples.
- AXI Barcode Management: ensures full traceability of each inspection via barcode tracking.
- Extended BGA Inspection: fast selection and indexing of individual solder balls for accurate and repeatable results.
- Extended ADR Interface: software that can be customized by the customer for repetitive routine inspection tasks.
- Upgrade to CT: system upgrade available for future retrofitting with Computed Tomography.
- Filter and HDR_Inspect: specifically developed for the electronics industry, it highlights critical areas with a single click. It detects even the smallest grey-scale variations, helping prevent errors in defect analysis.
- Multi Area Void Calculation (MAVC): designed for void detection in solder joints and in highly critical and complex areas.
- User-Friendly GUI: new operator interface and larger monitor for improved usability.
